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Wafer Polishing/Electronics Industry

More stringent requirements for polishing solutions has created a need for premium products for this application. The answer REMET has found is Syton® HT-50.

REMET distributes Syton® HT-50, which is an aqueous colloidal silica and an excellent choice for use as a base material in the prime silicon wafer polishing process.

This product has an average particle size of 40 nm and is sodium stabilized. In addition, it has one of the lowest metal contents of any commercially available colloidal silica.

Uses for this product range from: crystal manufacturing for filtration in electronics, optics and acoustics; to sapphire rod & blanks, optoelectronics and high output LED; to proprietary polishing solutions; and finally, to ultra-flat silicon, SOI and GOI substrates for microelectronic and optoelectronic applications.

Typical Properties for Syton® HT-50 are as follows:

Property Typical Value
Specific Gravity @ 20°C (gm/cm3) 1.390
SiO2 (weight %) 49.8
pH @ 20°C 10.2
Average Particle Size (nm) 40.0

Trace Metals
Iron 15.0 (ppm)
Aluminum 55.0 (ppm)
Copper 40.0 (ppb)
Chromium 350 (ppb)
Nickel 130 (ppb)

For more information about Syton® HT-50 and how it might be able to help with your particular application(s), please call your local REMET representative or e-mail us.

Syton is a registered trademark of the DuPont Corporation.

 


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REMET Corporation • 210 Commons Road • Utica, NY 13502 • ph (315) 797-8700 • fax (315) 797-4848